Fulldiamond grinding pad: The use of micro-powder diamond and resin chelate, noscratch, high yield, can greatly shorten the polishing time.
Application:It is suitable for fine grinding and polishing of sulfur small spheres ofinfrared materials and ceramic materials.
Particlesize: 4μm, 9μm.
Commonspecifications: φ640×235mm, φ380×145mm, can be customized according to customer grinding disksize.
