Full diamond grinding pad: The use of micro-powder diamond and resin chelate, no scratch, high yield, can greatly shorten the polishing time.

Application: It is suitable for fine grinding and polishing of sulfur small spheres of infrared materials and ceramic materials.

Particle size: 4μm, 9μm.

Common specifications: φ640×235mm, φ380×145mm, can be customized according to customer grinding disk size.