Zhengzhou Longda Abrasives and Grinding Tools Co.
White polishing pad for microfiber silicon wafers and wafers:
LD800, microfiber polyurethane products, hardness Shao Shore80±3, acid and alkali resistance, oxidation resistance, high polishing rate, can adapt to different materials polishing liquid, no scratch surface, high yield.
LD860, microfiber polyurethane products, hardness Shao Shore86±3, acid and alkali resistance, oxidation resistance, high polishing rate, can adapt to different materials polishing liquid, no scratch surface, high yield.
LD930, microfiber polyurethane products, hardness Shao Shor93±3, acid and alkali resistance, oxidation resistance, high polishing rate, can adapt to different materials polishing liquid, no scratch surface, high yield.
Application: Suitable for polishing and rough polishing of sapphire window, substrate, silicon wafer, semiconductor material, etc.
Common specification
Square pieces: 850×850,900×900,1000×1000,1200×1200,1400×1400mm, etc.;
Round plate: diameter from 75-1400mm, etc.; Can be customized according to customer needs any specifications.
Commonly used thickness: 1.0, 1.3, 1.5, 2.0, 3.0mm;
Special requirements
Steps 1 Finish the back glue.
2. Grooving processing, 10x10, 18x18, 20x20, 30x30, 36x36, 50x50mm back glue firm and durable, stable and reliable.